Teaching & Presentations

Courses taught:                               (  Presentation / Talks  below )

• G166 Engineering Physics
• G167 Common Engineering Chemistry
• SM103 Physics I
• G269 Engineering Materials
• SM465 Microlithography
• SM466 Thin Film Processes
• SM469 Microelectronic Process Integration

SM103 Physics I

Instructor: Dr. Shu Yuan, ext. 5803, e-mail: assyuan@ntu.edu.sg, Office: N4-02B48

Description:

Coulomb’s law. Electric field. Electric flux and Gauss’ law in electrostatics. Electric
potentials and equipotential surfaces. Motion of a charged in an electric field. Currents in
materials. Magnetic fields. Magnetic force on electric charges and currents. Motion of a
charged particle in a magnetic field. Ampere-Maxwell law, Gauss’ law in magnetism.
Faraday’s law, Motional emfs and induced electric fields. Eddy currents. Magnetism in
materials. Electronic components. Conductors, insulators and superconductors. Electrical
conduction mechanism. Electrical energy and power. DC circuits: Series circuits, parallel
circuits, series-parallel circuits. Kirchhoff’s laws. Introduction to alternating current and
voltage. Capacitors. Inductors. Transformers. RC and RL circuits. RLC circuits and
resonance. Introduction to semiconductor devices. Diodes and their applications. Transistors
and thyristors. Amplifiers and oscillators. Integrated circuit. Related laboratory experiments
in electronics.

ME465 Microlithography

Instructor: Dr. Shu Yuan, ext. 5803, e-mail: assyuan@ntu.edu.sg, Office: N4-02B48

Description:

Introduction. Photolithography strategies. Basic processes. Photomasks. Photoresist
materials for UV, deep UV, electron beam, ion beam and x-ray lithography. Interaction
between the polymeric photoresists and various types of radiation. Sensitivity and contrast.
Sources of problems. Multilayer resist systems. Principles of imaging. Methods for optical
exposure. Selective removal of materials. Process flow. Principles of electron beam, ion
beam and x-ray lithographic techniques.

 

SM466 THIN FILM PROCESSES

Academic Units: 4
Pre-requisites: SM208 & SM302

Introduction: process integration; process sequence, layout of integration; process development issues. CMOS well technology: basic concepts of CMOS; NMOS, PMOS, twin well, retrograde-well CMOS. Isolation module technology: shallow trench and refill isolation; junction isolation. Gate module technology: ultrathin gate dielcetric; gate dielectric materials, characteristics of ultrathin dielectric, high density plasma damage; gate oxidation; rapid thermal oxidation, furnace oxidation, fast thermal oxidation; salicidation; titanium salicidation, cobalt salicidation; gate electrode; poly gate deposition. Contact module technology: contact structures in device; theory of metal-semiconductor contacts; schottky-barrier contacts, diffusion barrier; intrinsic series resistance. Metallization: materials; phase diagram, diffusion barrier; process and system; evaporation, sputtering, chemical vapor deposition. Reliability: electromigration, stress migration, junction spiking. Packaging and yield: wire bonding; surface mounting; flip-chip; defect density; alpha particle induced soft errors. Characterization of film: analysis; topography, crystallography, adhesion, stresses. Applications of thin films: LCD; transparent conducting thin film, amorphous silicon thin film; Magnetic thin film; quantum engineering application.

SM469 Microelectronic Process Integration

Instructor: Dr. Shu Yuan, Office: N4.1-B1-16, Tel 6790-5803, assyuan@ntu.edu.sg

1. Introduction to IC Process Integration 2. CMOS Technology 3. Isolation Module Technology 4. Gate Module Technology 5. Contact Module Technology 6. Interconnect and Materials 7. Device Scaling and IC Technology Trend

 

Presentations/Talks

• How to startup a company from scratch (talk at Southern University of Science and Technology, Sept. 22, 2016)